High Density Interconnect PCB Market Research Report- Forecast till 2023
Market Research Future (MRFR) expects the high-density interconnect (HDI) printed circuit board (PCB) market 2020 to reach a size of USD 15,600.6 million by 2023. The market can also witness significant progress at a rate of 12.4% between 2018 and 2013 (review period). We will provide covid-19 impact analysis with the report. The COVID-19 impact on the market has been studied in the report, which offers an in-depth analysis post the coronavirus disease outbreak.
The HDI PCB market has felt the COVID-19 impact significantly, which has led to huge revenue loss. While a number of sectors are dealing with the aftereffects of the pandemic, the semiconductor industry can be the most affected in the long run. Following the onset of SARS-CoV-2, various high density interconnect PCB market companies have been facing tough decisions, in terms of cost-cutting measures as well as finance required to maintain continuous flow of operations. The lockdown is the short term impact of the novel coronavirus, which has shut down many of the manufacturing sectors and has led to a fall in the demand for fiber optics.
The falling demand has had a domino effect throughout the semiconductor industry, as the SARS-CoV-2 outbreak has resulted in the closing down of various operations, along with e-commerce and retail stores. This has also resulted in the collapsing of supply chain networks and has widened the gap between demand and supply in the market. However, following the pandemic, experts believe that the demand for high density interconnect PCB’s has risen considerably in the healthcare industry. Their applications are extensive in medical devices such as CT scans, defibrillators, MRIs, ultrasonic equipment, medical imaging systems, electrical muscle stimulation equipment, and more.
Primary Boosters and Main Barriers
In an attempt to maintain their leadership in the high density interconnect PCB market, many of the companies are collaborating to leverage each other particular expertise and come up with advanced PCBs with stronger application scope across sectors. To cite a reference, in May 2020, HENSOLDT and Nano Dimension, a renowned Printed Electronics provider found a significant breakthrough with the use of 3D printing to develop high-density electronic components. With extensive use of conductive ink along with dielectric polymer ink offered by Nano Dimension, HENSOLDT was able to develop the first 10-layer printed circuit board in the world, which can carry high-performance electronic components.
MRFR experts envision a promising future for the high-density interconnect PCB market, with a lot of opportunities in consumer electronics, telecommunication equipment, computer, automotive, smartphone and more. The market significantly benefits from the consumer electronics industry, the mounting need for high performance devices and increasing miniaturization of electronic devices. Key trends influencing the worldwide market include soaring demand for high-speed and low loss HDI PCBs.
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The HDI PCB industry has been considered for number of high-density interconnection layer, and industry vertical.
The segments, depending on the number of high density interconnection layers, include 1, 2, and all.
The industry verticals that majorly deploy HDI PCBs are manufacturing, automotive, telecom and IT, medical devices, consumer electronics, military and defense, to mention a few.
The geographical segregation of the HDI PCB market covers Europe, North America, Asia Pacific/APAC, and RoW/rest of the world.
North America can gain the highest spot in the global market over the conjectured period. Being a technologically developed region, North America benefits massively from the presence of a well-established semiconductor industry. The HDI PCB market generates substantial revenues, especially from consumer electronics and automotive verticals. The US can be the leading market in the region, given the expanding smartphone industry and the rising need for high-speed/ low loss HDI PCBs
The APAC market can observe the fastest growth rate over the next few years, on account of the high availability of cheaper priced technologies and the fact that the region consists of a huge number of electronic devices manufacturers. India, Japan, and China are the most lucrative markets in the region, thanks to the rising utilization of electronic components in automotive combined with the expanding industries of consumer electronics and telecommunication.
Renowned companies in the market are RAYMING (China), Advanced Circuits (US), Austria Technologie & Systemtechnik Aktiengesellschaft (Austria), Millennium Circuits Limited (US), FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan), Epec, LLC (US), FINELINE Ltd. (Israel), SIERRA CIRCUITS, INC. (US), TTM Technologies (US), Mistral Solutions Pvt. Ltd. (India), PCBCART (China), to list a few.
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High Density Interconnect PCB Market Research Report, By Number of Number of High-Density Interconnection Layer (1, 2 or more, all), Industry Vertical (consumer electronics, military and defense, telecom and IT, automotive) — Global Forecast till 2023
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