Rochester, MN / San Francisco, CA – August 21, 2017 – LiquidCool Solutions (LCS) today announced it will bring new energy to InterPACK 2017 as CEO Herb Zien takes the stage to discuss its server technology that will completely change the way data centers are constructed and operated. Taking place August 29 through September 1 at the Hilton San Francisco Financial District, InterPACK 2017 is the premier international forum for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronic packaging, MEMS, and NEMS.
During the event, Zien will demonstrate how LCS server technology reduces the power needed for cooling data centers by 98% and slashes the carbon footprint. The LCS IT equipment requires no water or air conditioning, which means it could be located anywhere including the factory floor or the mechanical room, and there is no noise.
The Technical Session, 2-1-3 Server Cooling 2, will take place Wednesday, August 30 from 2:15 PM – 03:45 PM and chaired by experts from Microsoft and Intel.
Zien will also point out an obvious and profound fact: air is an insulator, not a heat transfer fluid.
Today’s predominant datacenter cooling design is air cooling, yet circulating conditioned air through servers and racks from holes in the floor ignores basic laws of physics. Air has low heat capacity and thermal mass. Contact with air reduces the life of electronic equipment. Fans are needed to circulate air, and they are energy inefficient and prone to failure. Furthermore, fans generate a lot of heat that must be dispersed, adding to the cooling burden.
The “Server of the Future that is Commercially Available Today” addresses four key data center cooling issues. It completely eliminates air cooling; it removes 100% of the heat in the liquid; it uses zero water; and it captures high-quality heat (above 135F) for reuse. The power needed for cooling is reduced by 98% and the carbon footprint is slashed. Additionally, the “Server of the Future that is Commercially Available Today” is cost efficient, scalable and easy to maintain.
“The absurdity of air cooling data centers opened the door for disruptive technology,” said Herb Zien, CEO LiquidCool Solutions. “Starting with a clean sheet of paper, LCS took the time to understand the underlying challenges with current data center cooling technology and came up with an elegant solution — a cleverly executed liquid cooling technology that reduces data center energy waste, water usage, carbon footprint and cost.”
Data centers that utilize LCS cooling solutions will demonstrate environmental responsibility while benefitting from operating cost savings, enhanced reliability and ease of maintenance. Upfront capital cost will be lower too. For those data centers, the future is now.
About LiquidCool Solutions
LiquidCool Solutions is a technology development firm with 30 issued patents centering on cooling electronics by total immersion in a dielectric fluid. LCS technology places special emphasis on scalability and rack management. Beyond providing superior energy savings, performance and reliability, LCS technology enables a broad range of unique applications not possible with any other air or liquid cooling systems.
Company Name: LiquidCool Solutions
Contact Person: Patti D. Hill
Country: United States