The electronics industry has witnessed a sea change in terms of underpinning technologies and the way they are integrated in the past couple of years. In most cases, this has upped the total power consumed by the devices which seem to be getting smaller by the day. This has necessitated heat density management through the development of effective heat management technologies.
At present, high-performance heat spreader systems that leverage multi-phase cooling in place of alloy-based heat spreaders is one of the most researched areas in the field of thermal management technologies. There is also substantial ongoing research in fabrication or discovery of structures and materials capable of providing notable decline in the thermal resistance of the thermal interface layer between the back layers of electronic devices, which could be a heatsink.
The global thermal management technologies market is choc-a-bloc with players and no single player enjoys dominance over the market. From a geographical standpoint, Asia Pacific is the primary contributor to the revenue in the market on account of the presence of some of the global electronic majors in nations such as Japan, South Korea, and China. Europe is another key market owing to a robust electronic manufacturing and research and development facilities in nations of Germany and the US. The EU regulations requiring the use of thermal interface in electronic devices is also said to be driving the market in the continent. Add to that increasing concerns about the rising ranks of discerning consumers about the environment and what you have is further focus on the development of environment-friendly heat management materials.
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Global Thermal Management Technologies Market: Overview
The electronics industry has seen significant enhancements in technologies, system integration, and fundamental materials used to manufacture elemental structures in the past few years. This has led to a rapid rise in the total power consumed by the device, which, in several cases, are seeing a rapid reduction in size. Supplying high power to such devices, with electronic parts crammed in small packages, make the issue of heat density management even worse for the industry. This has increased the industry’s focus on the development of efficient heat management technologies.
This report on the global thermal management technologies market covers the state of research and development activities undertaken in this area and their influence on the electronics industry as seen in the past few years. A detailed overview of the thermal management technologies market’s present growth dynamics and several forward-looking statements predicting the growth prospects of the market and its key segments over the period between 2017 and 2025.
Global Thermal Management Technologies Market: Trends and Opportunities
The development of high-performance heat spreader systems which use multi-phase cooling in place of alloy-based heat spreaders in conventional systems is presently one of the most researched areas in the field of thermal management technologies. Research efforts in the area so far have led to the development of technologies such as cold plates, jet impingement, and heat vapor chambers. Research is also underway in fabrication/discovery of structures and materials capable of providing notable decline in the thermal resistance of the thermal interface layer between the back layers of electronic devices, which could be a heatsink.
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Of the key components of a typical thermal management solution, namely thermal management hardware, thermal management interface product, thermal management software, and thermal management substrates, the hardware segment is presently the leading contributor of revenue to the global market. The rising demand for compact microprocessors is expected to enable the hardware segment lead over the next few years as well.
The segment of thermal management interfaces is also expected to see demand rise at a promising incremental pace over the report’s forecast period. The rising implementation of thermal management interfaces in automated machineries and portable and miniaturized computing devices such as smartphones and tablet computers will be the key to healthy growth prospects of the thermal management interface segment.
Global Thermal Management Technologies Market: Geographical and Competitive Dynamics
From a geographic perspective, the report presents an analytical overview of the thermal management technologies market for regional markets such as North America, Asia Pacific, Europe, and Middle East and Africa. Of these, Asia Pacific is expected to be the leading contributor of revenue to the global market over the forecast period. The presence of some of the world’s leading electronic companies in countries such as South Korea, China, and Japan will further strengthen the demand prospects for thermal management technologies in the region over the forecast period.
Europe, with the large number of electronic manufacturing and R&D facilities in countries such as the UK and Germany, is also expected to see a rise in use of thermal management technologies in the near future. The Europe market is also expected to thrive due to stringent EU regulations necessitating the use of thermal interface in electronic devices. The heightened consumer awareness about environment sustenance is expected to lead to an increased focus on the development of environment-friendly heat management materials in the near future.
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It has been found that the global thermal management technologies market features an exceedingly fragmented competitive landscape, wherein no leading player accounts for a major share in the global market’s revenue- or value-wise valuation. Some of the market’s leading players are Honeywell International, LairdTech, Alcatel-Lucent, Pentair Thermal Management, Thermacore, Heatex, Aavid Thermalloy, Advanced Cooling Technologies, Thermal Management Technologies, Sapa Group, and Honeywell International.
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