Failure Analysis 2017 Global Market Growth, Opportunities and Analysis, Forecast To 2022

“Global Failure Analysis Market”
Market Analysis Research Report on “Global Failure Analysis Market 2017 Industry Growth, Size, Trends, Share, Opportunities and Forecast to 2022” to their research database.

Global Failure Analysis Market

Failure is termed as the loss of functional integrity of a system or a group of system leading to loss of life, economy, or output. Failure Analysis refers to the analysis of possible ways of failure of electrical, electronic and mechanical parts of a system that has undergone a breakdown. Several tests are performed to analyze the occurrence. Failure Analysis is a process that is performed to collect, determine and analyze the factors that have resulted in an undesired loss of functionality, that is failure of structures, assemblies or components. The importance of Failure Analysis lies in its need to improve the product and its performance aspects, thereby assisting in solving industrial problems.

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The major players in the failure analysis market include:

Thermo Fisher Scientific (U.S.) 
FEI Company (U.S.) 
Carl Zeiss SMT GmbH (Germany) 
Hitachi High-Technologies (Japan) 
JEOL Ltd. (Japan) and others

Failure analysis is done to ensure product life as well as its quality, prevent product malfunction, achieve process reliability, prevent customer dissatisfaction, and prevent safety or environment hazards. This analysis is done in almost every industry to increase the reliability of the output. The failure analysis market boosts revenues due to increase in demand for failure analysis equipment from wireless communication and electronics manufacturing industries.

The global failure analysis market is estimated to reach $7.3 billion by 2021 growing at a CAGR of 7.76% through 2016 to 2021. The Americas region accounted for the highest share of the revenue in 2015; this market is estimated to be the market leader throughout the forecast period. The American market is estimated consistent growth through the forecast period. However the fastest growing market will be APAC owing to the high rate of industrialization in the region. Moreover, the semiconductor industry in APAC has witnessed increased focus on reliability of products in recent years leading to growing NDT and functional failure testing prior to distribution.

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The report on failure analysis has been divided into four segments namely by test, by technique, by product and by end user industry.

The various Failure Analysis Tests incorporated in the study include-

Contamination Analysis 
Corrosion Investigation 
Fractography 
Metallography 
Mechanical Testing 
Chemical Analysis and Testing 
NDT 
Weld Testing 
Microstructure Evaluation 
Adhesive Identification 
Coating Contamination 
Thermal Mapping 
Electrical Overstress(EOS)/Electrostatic Discharge(EDS) 
Regulatory Compliance Testing

This market is subsequently segmented by geographical regions; Americas, Europe, Asia-Pacific (APAC) and Rest of the World (RoW) have also been provided to give a comprehensive analysis of the market. Apart from this, the report also includes pricing and value chain analysis separately that will provide key insights and market scenario. Forecasts are provided for all the market segments for the period 2016-2021.

  1. Failure Analysis Market Overview 
    Executive Summary 
    3. Failure Analysis Market Landscape 
    3.1. Market Share Analysis 
    3.2. Comparative Analysis 
    3.2.1. Product Benchmarking 
    3.2.2. Patent Analysis 
    3.2.3. End User Profiling 
    3.2.4. Top 5 Financials Analysis 
    4. Failure Analysis – Market Forces 
    4.1. Market Drivers 
    4.2. Market Constraints 
    4.3. Market Challenges 
    4.4. Attractiveness of Failure Analysis Market 
    4.4.1. Power of Suppliers 
    4.4.2. Power of Customers 
    4.4.3. Threats of New Entrants 
    4.4.4. Threats of Substitution 
    4.4.5. Degree of Competition 
    5. Failure Analysis Market – Strategic Analysis 
    5.1. Value Chain Analysis 
    5.2. Pricing Analysis 
    5.3. Opportunity Analysis 
    5.4. Product/Market Life Cycle Analysis 
    5.5. Suppliers and Distributors 
    6. Failure Analysis Market – By Test 
    6.1. Contamination Analysis 
    6.2. Corrosion Investigation 
    6.3. Fractography 
    6.4. Metallography 
    6.5. Mechanical Testing 
    6.6. Chemical Analysis and Testing 
    6.7. NDT 
    6.8. Weld Testing 
    6.9. Microstructure Evaluation 
    6.10. Adhesive Identification 
    6.11. Coating Contamination 
    6.12. Thermal Mapping 
    6.13. Electrical Overstress(EOS)/Electrostatic Discharge(EDS) 
    6.14. Regulatory Compliance Testing 
    6.15. Others 
    7. Failure Analysis Market – By Technique 
    7.1. Destructive Physical Analysis 
    7.2. Physics of Failure Analysis 
    7.3. Fault Tree Analysis(FTA) 
    7.4. Common-Mode Failure Analysis 
    7.5. Failure Modes Effect Analysis(FMEA) 
    7.6. Failure Modes, Effects, and Criticality Analysis(FMECA) 
    7.7. Functional Failure Analysis 
    7.8. Sneak Circuit Analysis 
    7.9. Software Failure Analysis 
    7.10. Others 
    8. Failure Analysis Market – By End User Industry 
    8.1. Oil and Gas 
    8.2. Aerospace 
    8.3. Automotive 
    8.4. Construction 
    8.5. Chemical and Pharmaceutical 
    8.6. Food and Beverage 
    8.7. Industrial 
    8.8. Defense 
    8.9. Metrology and Calibration 
    8.10. Others 
    9. Failure Analysis Market By Product 
    9.1. Transmission Electron Microscope 
    9.2. Focussed ion beam Systems 
    9.3. Scanning Electron Microscopy 
    9.4. Dual Beam Systems 
    9.5. Others 
    10. Failure Analysis Market – By Region 
    10.1. America 
    10.1.1. U.S 
    10.1.2. Canada 
    10.1.3. Brazil 
    10.1.4. Others 
    10.2. Europe 
    10.2.1. Germany 
    10.2.2. U.K 
    10.2.3. France 
    10.2.4. Others 
    10.3. Middle East 
    10.3.1. Saudi Arabia 
    10.3.2. United Arab Emirates 
    10.3.3. Israel 
    10.3.4. Qatar 
    10.3.5. Others 
    10.4. APAC 
    10.4.1. China 
    10.4.2. South Korea 
    10.4.3. Japan 
    10.4.4. India 
    10.4.5. Others 
    10.5. ROW 

Continued…….

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