As per the new market report published by Factor & Equilibrium (www.factorandequilibrium.com) “Thin Wafer Processing and Dicing Equipment Market – Global Industry Insights Market Size, Estimation and Growth Forecast, By Application – (MEMS, Logic and Memory, Power Device, CMOS Image Sensor, and RFID), By Wafer Thickness – (750 micrometer, 120 micrometer, and 50 micrometer), By Dicing Technology – (Blade Dicing, Laser Dicing, and Plasma Dicing)& By Regions, 2017 – 2025” is expected to reach USD 734.1 million by 2025 in terms of revenue. In 2016, the market was valued USD 412.3 million in terms of revenue. In terms of volume, thin wafer processing and dicing equipment market size was 717 units in 2016 and expected to reach 1,486 units by 2025.
Browse 46 Data Tables and 63 Figures in the full report at https://www.factorandequilibrium.com/market-report/thin-wafer-processing-and-dicing-equipment-market-analysis
Thin wafer dicing and processing equipment market is expected to witness strong growth during the forecast period. This is mainly due to increasing demand for three dimensional integrated circuits across different end use applications such as portable consumer electronic devices, sensors, microelectromechanical systems (MEMS) and industrial products among others which in turn is anticipated to be a major driving factor for the global thin wafer processing and dicing equipment market in future.
By application, the thin wafer processing and dicing equipment market has been classified into logic and memory, micro electro mechanical systems (MEMS), power device, radio frequency identification (RFID), and CMOS image sensor. Increasing demand for ultra-thin silicon wafer in order to manufacture integrated circuit that acts as the integral part of next generation smart phones, camera, hologram projector and car sensor among others is predicted to create better opportunities for various thin wafer processing and dicing equipment in the coming years. In 2016, the global demand for thin and ultrathin wafer is majorly dominated by the MEMS segment.
Rising demand for advanced thin wafer to manufacture thin solar cells to be used in solar panel is estimated to accelerate the demand for thin wafer processing and dicing equipment in the coming years
By wafer thickness, the thin wafer processing and dicing equipment market has been classified into 750 micrometer, 120 micrometer, and 50 micrometer. In addition, 120 micrometer segment is expected to grow at a high CAGR of 7.5% during the forecast. Increasing trend of miniaturizing various RFID and power devices in order to obtain better form factor and enhanced electrical performance is responsible for the robust demand of processing and dicing equipment for wafers having thickness of 120 micrometer.
In terms of both revenue and volume, 750 micrometer segment had the largest share in thin wafer dicing and processing equipment market in 2017.
By dicing technology, the thin wafer dicing and processing equipment markethas has been bifurcated into blade dicing, laser dicing, and plasma dicing. The blade dicing technology has been anticipated to have the highest market during the forecast period. In addition, laser dicing technology is also the fastest growing segment in the industry and contributing significant share in thin wafer processing and dicing equipment market size. However, plasma dicing technology is also expected to witness promising growth in future.
In terms of both revenue and volume, Blade Dicing Technology was the largest by dicing technology in thin wafer dicing and processing equipment market in 2017.
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The global thin wafer dicing and processing equipment market has been segment into five key geographical regions: North America, Europe, Asia-Pacific, Middle East & Africa and South America. North America and Asia-Pacific have been analyzed to have the largest market share with more than 65% of the market during the forecast period. In addition, the Asia-Pacific region is anticipated to increase in dominance in the coming years owing to the presence of large number of market players coupled with extensive research and development activities taking place in the field of wafer processing and dicing equipment in order to overcome various limitations. Furthermore, the Asia-Pacific has been identified to be the fastest growing region during the forecast period. Additionally, China and Japan is anticipated to witness a stable growth of the thin wafer processing and dicing equipment market and is conserved to be an important competitor of different manufacturer in US.
Asia-Pacific occupied the largest revenue and volume share of the market
Leading Player Mapping
The leading operating in the thin wafer processing and dicing equipment industry included EV Group (Austria), Lam Research Corp (The U.S), Plasma-Therm LLC (The U.S), DISCO Corp.(Japan), Tokyo Electron Ltd.(Japan), Advanced Dicing Technologies (Israel), Suzhou Delphi Laser Co. Ltd.(China), SPTS Technologies Ltd. (U.K), Tokyo Seimitsu Co. Ltd.(Japan), and Panasonic Corp.(Japan) among others.
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The market has been segmented as follows:
Thin Wafer Processing and Dicing Equipment Market: By Application
- Logic and Memory
- Micro Electro Mechanical Systems (MEMS)
- Power Device
- Radio Frequency Identification (RFID)
- CMOS Image Sensor
Thin Wafer Processing and Dicing Equipment Market: By Wafer Thickness
- 750 Micrometer
- 120 Micrometer
- 50 Micrometer
Thin Wafer Processing and Dicing Equipment Market: By Dicing Technology
- Blade Dicing
- Laser Dicing
- Plasma Dicing
Thin Wafer Processing and Dicing Equipment Market: By Geography
- North America (U.S. and Canada)
- Europe (U.K., Germany, France, CIS + Scandinavia and Rest of Europe)
- Asia-Pacific (China, Japan, Taiwan, South Korea and Rest of Asia-Pacific)
- Middle East & Africa (Israel, South Africa and Rest of Middle East & Africa)
- South America (Brazil, Mexico and Rest of South America)
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