LiquidCool Solutions CEO Darwin Kauffman and Engineered Fluids CEO Gary Testa to Present at OCP U.S. Summit 2018 on Advanced Cooling for Data Center Applications

“CEOs will provide a vision of how data centers can leverage LiquidCool and Engineered Fluids’ technology to maximize the return on investment in existing data center infrastructure.”

Rochester, MN – March 20, 2018 – LiquidCool Solutions, Inc. today released details about its participation at OCP U.S. Summit 2018 taking place March 20 – 21 at the San Jose Convention Center. LiquidCool CEO Darwin Kauffman joins Engineered Fluids CEO Gary Testa to discuss the benefits single-phase, liquid immersion cooling delivers without the operational challenges posed by other full immersion technologies, particularly in energy efficiency and capital savings.

The annual event is produced by Open Compute Project (OCP), a collaborative community focused on redesigning hardware technology to efficiently support the growing demands on compute infrastructure.

Details on the Executive Panel on Advanced Cooling

Title:  An Innovative Immersion Cooling Approach for Shrinking OCP Data Center Size, Complexity, and Costs

Panel Overview: Liquid immersion cooling systems for data center servers are attracting increased interest, due to its ability to enable higher compute density at substantially lower costs. This presentation will introduce an innovative single-phase, liquid immersion cooling solution for data centers developed by LiquidCool Solutions in partnership with Engineered Fluids.

For many people, the term “liquid immersion cooling” has many different meanings based on the technologies developed over the years. LiquidCool has taken an entirely different approach to immersion cooling that achieves all the benefits: Maximizing CAPEX, reducing OPEX and increasing compute and storage density.  The key to achieving these benefits is LiquidCool’s patented Directed-Flow total immersion technology combined with the use of Engineered Fluids’ ElectroCool Biodegradable Dielectric Coolants.   As validation of the benefits, the presentation will describe testing of a small-scale version of a LiquidCool Solutions immersion cooled server system conducted at the National Renewable Energy Laboratory (NREL).

Finally, the presentation will provide a vision of how data centers can leverage LiquidCool and Engineered Fluids’ technology to maximize the return on investment in existing data center infrastructure.

Date & Time: Wednesday, March 21at 2:00 p.m.

Room: 210H

“With Big Data, AI, IoT and now Blockchain applications, Data Center early adopters see the ROI on liquid-cooling in the data center,” said Kauffman. “They can more-efficiently use future CAPEX investments, lower their OPEX while increasing facility space density to support future compute capacity demands.”

“Not only does our ElectroCool single-phase, dielectric coolants optimize compute performance and reliability, it is also environmentally friendly. It is non-toxic, biodegradable, no vapor pressure and has 1,600 times the heat-removing capacity of air by volume,” said Testa.

Additional information on OCP U.S. Summit 2018 can be found online at: http://www.opencompute.org/ocp-u.s.-summit-2018/

About LiquidCool Solutions

LiquidCool Solutions builds rugged, high-density computing solutions for manufacturing, utilities, construction, real estate and cryptocurrency mining markets. Its award-winning, directed-flow, immersion cooling enables high-performance computing in any environment.  All units are sealed to protect electronics from heat, humidity, dust, oxidation, and corrosive gases, and the fan-free design produces a system that is highly reliable, requires no air conditioning and is virtually silent. With LiquidCool, early adopters and technologists investing in technologies to drive revenues experience increased compute reliability, performance and space density along with lower electricity costs and a quiet, cool workspace environment.

For more information, please visit www.liquidcoolsolutions.com or call (866) 530-0101.

About Engineered Fluids

Engineered Fluids is the world’s premiere developer and manufacturer of single-phase dielectric coolants for servers, GPUs, hybrid and electric motors, batteries, lasers, and other high power, high heat electronic equipment.  Engineered Fluids’ ElectroCool® Dielectric Coolants provide over 1600x the heat density of air, while providing industry leading materials compatibility and oxidation stability across a temperature range of -57 to over 250C.  Engineered Fluids offers dielectric coolants for use in wide range of partner designed full immersion cooling solutions.   Engineered Fluids is committed to significantly reducing the overall total cost of ownership while dramatically increasing the reliability and eliminating the maintenance of deployed systems.

To learn more, visit www.engineeredfluids.com or email info@engineeredfluids.com

Media Contact
Company Name: LiquidCool Solutions
Contact Person: Patti D. Hill
Email: patti@penmanpr.com
Phone: 314-659-8430
City: Rochester
State: MN
Country: United States
Website: www.liquidcoolsolutions.com