Chip on Flex Global Market – Overview
The Global Chip on Flex market is growing with the rapid pace; owing to the technological advancements in the display technologies. Chip on Flex is a very interesting and promising interconnection method that are used especially in portable electronic products such as mobile phones, portable terminals, and digital cameras and among others. In the process of Chip on Flex, integrated circuits (IC) are normally connected using anisotropically conductive adhesives. Various technological advancement and development of cost effective flexible printed boards are major factors that affects the demand. The growing electronic content in various industries like automotive and consumer electronics majorly impacts the industry growth in future. Scaling down of devices has encouraged the COF demand across application areas including consumer electronics, medical, military, aerospace and among others.
Small and flexible electronics are found in applications in various current and existing markets that includes displays, sensors, lighting, biomedical implants, and radio frequency identification among others. Some of these applications are taking advantage of printed active electronics that offers manufacturing advantages but exhibits relatively poor performance. However in many cases, the combination of traditional semiconductor performance with a flexible substrate is attractive. For instance, traditional semiconductors are required for efficient high speed wireless communications. Therefore, the increasing need for small and flexible electronics is driving the Chip on Flex market. Apart from it, the use of flex circuits in the wearable electronics reflects as an opportunity for the Chip on Flex market.
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Jan 2018 – Flex Logix™ Technologies, Inc., have announced that its embedded FPGA technology will be used by a consortium of Israeli semiconductor and systems companies including Mellanox, Satixfy, DSP Group and AutoTalks under a license with Bar Ilan’s SoC Lab which is part of the HiPer Consortium.
Jan 2016 – ChipMOS Bermuda and Chipmos Taiwan have agreed to merge; this merger would result in chipmos bermuda holders to receive USD 19.77 in cash and stock for each Chipmos Bermuda common share.
The prominent players in the market of Chip On Flex Market are – LGIT corporation (U.S.), Stemko group(Korea), Flexceed(Japan) , Chipbond technology corporation(Taiwan), CWE(Taiwan), Danbond technology co. ltd.(China), AKM industrial company ltd.(China), compass technology company limited(Hong Kong), Compunetics(U.S.), and Stars microelectronics public company ltd (Thailand) among others.
Chip on Flex Global Market – Segmentation
The Chip on Flex Market can be segmented in to 4 key dynamics for the convenience of the report and enhanced understanding;
- Segmentation By Type: Comprises Single Sided Chip On Flex, Others.
- Segmentation By Verticals: Comprises Military, Medical, Aerospace, Electronics among others.
- Segmentation By Application: Comprises Static, Dynamic others
- Segmentation By Regions: Comprises Geographical regions – North America, Europe, Asia Pacific and Rest of the World.
Chip on Flex Global Market – Regional Analysis
Asia-Pacific is dominating the Global Chip on Flex Market with the largest market share. Growing economy of Asian countries such as China and India and strong presence of manufacturing industry in China region is supporting the growth of chip on flex market in this region. The existence of large number of chip on flex manufacturers in China like Danbond Technology, AKM Industrial, Compass Technology Company are significantly contributing to the market growth. Chip on Flex Market in North America market is expected to grow at a substantial CAGR during 2016 to 2022 owing the increasing advancements in flexible display technology observed in this region. The European market for Chip on Flex Market is expected to grow at a considerable CAGR (2016-2022).
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- COF manufactures
- Industries such as aerospace, automotive, IT, industrial, and medical, among others
- Government institutions
- Research institutions
- Adhesive manufacturers
- Conductor and insulator manufacturers like silver, copper and others
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