Global Semiconductor Assembly and Packaging Services Market to grow at a CAGR of 4.87% during the period 2018-2022.

Semiconductor assembly and packaging services Market are crucial in the semiconductor production process. The package of the semiconductor device is usually made of materials such as plastic, metal, and ceramic/glass. Packaging is undertaken to provide protection against impact and corrosion.

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Covered in this report
The report covers the present scenario and the growth prospects of the global semiconductor assembly and packaging services market for 2018-2022. To calculate the market size, the report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.

The market is divided into the following segments based on geography:
•    Americas
•    APAC
•    EMEA

Global Semiconductor Assembly and Packaging Services Market 2018-2022, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
•    ASE
•    Amkor Technology
•    Intel
•    SAMSUNG ELECTRONICS
•    SPIL
•    TSMC

Market driver
• Rising number of fabs
• For a full, detailed list, view our report

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Market challenge
• Requirement of high initial capital investment
• For a full, detailed list, view our report

Market trend
• Advances in wafer size
• For a full, detailed list, view our report

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