The growing semiconductor & microelectronics industry is developing a trend for vertically stacked integrated circuits (ICs) which is emerging as viable solution for providing high performance, increased functionality and reducing power consumption to fulfill electronic device requirements. These ICs are in great demand by military & aerospace, medical and consumer electronics industries to fulfill need of integrating disparate technologies which includes logic, memory, RF, sensor in small forms for industrial applications.
One of the emerging trend in the semiconductor industry is 3D packaging using through silicon vias (TSVs) technology. This emerging trend is being driven by need of improving performance and to reduce timing delays. Low cost, high aspect ratio, reliable via formation & filling technologies are the need of today’s semiconductor industry. As functional integration requirement increases, assembly and wafer fabrication companies are looking for 3D TSV technology.
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The major factor that drives the growth of 3D IC market is growing increasing demand for advanced electronic products which is driving semiconductor industry to innovate new packaging technology and high demand for 3D packaging using TSVs are major factors driving market growth of 3D ICs during forecast period.
3D IC Market Segmentation
The 3D IC Market has been segmented on the basis of technology, component, product and applications. By technology, the market is being classified into type (3D stacked ICs and monolithic 3D ICs) and packaging & integration. By component, the 3D IC Market is categorized into through silicon vias (TSVs), and through glass vias (TGVs). By product, the market is further categorized into CMOS image sensors (CIS), 3D memory, MEMS & sensors, and light emitting diodes. By applications, the market is sub-segmented into IT/telecommunication, consumer electronics, industrial, aerospace & defense, automotive, medical and others.
Some of the major players in Global 3D IC Market include Xilinx Inc., Tezzaron Semiconductor Corporation, and BeSang Inc., Monolithic 3D Inc., United Microelectronics Corporation, 3M Company, Intel Corporation, and, IBM Corporation.
Market Research Analysis:
Regional analysis for 3D IC Market is studied in different geographic regions as Americas, Europe, Asia-Pacific and Rest of world. Asia-Pacific is dominating the market due to large semiconductor market and high growth of consumer electronics market in the region. China and Japan are the leading economy in production of integrated circuit in the region followed by India and Singapore. Europe is projected to be the second highest revenue generation region in 3D ICs market. Whereas, North America is subjected to be the fastest growing region in 3D IC market due to growing technological advancement in aerospace & defense and automotive market.
- Consumer electronics vendors
- Data center service providers
- Communication industries
- Research and consulting firms
- Small and large enterprises
- Government agencies
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TABLE OF CONTENTS
1 EXECUTIVE SUMMARY
2 MARKET DYNAMICS
2.1 Market Drivers
2.2 Market Challenges
2.3 3D ICs Supply Chain
2.4 Porter’s Five Forces Analysis
3 GLOBAL 3D ICS MARKET, BY TECHNOLOGY
3.1 3D IC Technology Type Market
3.1.1 Market By Sub-Segment
126.96.36.199 3D Stacked ICs
188.8.131.52 Monolithic 3D ICs
3.2 3D IC Packaging & Integration Type
184.108.40.206 3D System In Package (3D Sip)
220.127.116.11 3D Wafer Level Package (3D WLP)
18.104.22.168 2.5D & 3D Interposer
22.214.171.124 3D Heterogeneous Integration
4 GLOBAL 3D IC MARKET, BY COMPONENT
4.2 Market By Sub-Segment
4.2.1 Through Silicon Vias (TSVs)
4.2.2 Through Glass Vias (TGVs)
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