3D IC Market 2018 Global Overview, Business Growth, Development Status, Key Vendors Analysis, Regional Trends, Future Plans and Opportunity Assessment by Forecast 2022

“Market Research Future”
Market Research Future published a research report on “3D IC Market Research Report- Global Forecast to 2022” – Market Analysis, Scope, Stake, Progress, Trends and Forecast to 2023.

Market Scenario

The growing semiconductor & microelectronics industry is developing a trend for vertically stacked integrated circuits (ICs) which is emerging as viable solution for providing high performance, increased functionality and reducing power consumption to fulfill electronic device requirements. These ICs are in great demand by military & aerospace, medical and consumer electronics industries to fulfill need of integrating disparate technologies which includes logic, memory, RF, sensor in small forms for industrial applications.

One of the emerging trend in the semiconductor industry is 3D packaging using through silicon vias (TSVs) technology. This emerging trend is being driven by need of improving performance and to reduce timing delays. Low cost, high aspect ratio, reliable via formation & filling technologies are the need of today’s semiconductor industry. As functional integration requirement increases, assembly and wafer fabrication companies are looking for 3D TSV technology.

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The major factor that drives the growth of 3D IC market is growing increasing demand for advanced electronic products which is driving semiconductor industry to innovate new packaging technology and high demand for 3D packaging using TSVs are major factors driving market growth of 3D ICs during forecast period.

3D IC Market Segmentation

The 3D IC Market has been segmented on the basis of technology, component, product and applications. By technology, the market is being classified into type (3D stacked ICs and monolithic 3D ICs) and packaging & integration. By component, the 3D IC Market is categorized into through silicon vias (TSVs), and through glass vias (TGVs). By product, the market is further categorized into CMOS image sensors (CIS), 3D memory, MEMS & sensors, and light emitting diodes. By applications, the market is sub-segmented into IT/telecommunication, consumer electronics, industrial, aerospace & defense, automotive, medical and others.

Key Players:

Some of the major players in Global 3D IC Market include Xilinx Inc., Tezzaron Semiconductor Corporation, and BeSang Inc., Monolithic 3D Inc., United Microelectronics Corporation, 3M Company, Intel Corporation, and, IBM Corporation.

Market Research Analysis:

Regional analysis for 3D IC Market is studied in different geographic regions as Americas, Europe, Asia-Pacific and Rest of world. Asia-Pacific is dominating the market due to large semiconductor market and high growth of consumer electronics market in the region. China and Japan are the leading economy in production of integrated circuit in the region followed by India and Singapore. Europe is projected to be the second highest revenue generation region in 3D ICs market. Whereas, North America is subjected to be the fastest growing region in 3D IC market due to growing technological advancement in aerospace & defense and automotive market.

Target Audience:

  • Consumer electronics vendors
  • Data center service providers
  • Communication industries
  • Research and consulting firms
  • Small and large enterprises
  • Government agencies

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2.1 Market Drivers

2.2 Market Challenges

2.3 3D ICs Supply Chain

2.4 Porter’s Five Forces Analysis


3.1 3D IC Technology Type Market

3.1.1 Market By Sub-Segment 3D Stacked ICs Monolithic 3D ICs

3.2 3D IC Packaging & Integration Type 3D System In Package (3D Sip) 3D Wafer Level Package (3D WLP) 2.5D & 3D Interposer 3D Heterogeneous Integration


4.1 Introduction

4.2 Market By Sub-Segment

4.2.1 Through Silicon Vias (TSVs)

4.2.2 Through Glass Vias (TGVs)


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