Integrated circuit (IC) packaging has been revolutionized with advents made in flip chip technology. Introduced by IBM Corporation in 1960, this component has been transforming the face of consumer electronic devices ever since. The semiconductor device is designed to incorporate solder bumps over the connection pads of the IC or micro-electromechanical system (MEMS). Subsequently, it creates a reliable connection between the component and the board and this flip chip technology is finding its popularity amidst mainframe computers, personal computers, servers, notebooks, smartphones, tablets, and in other devices. Its features such as low power cost and high-density packaging are helping flip chip technology in gaining traction. The global flip chip technology market is expecting a substantial 8.29% CAGR to scale new heights during the forecast period (2017-2023). Market Research Future’s (MRFR) detailed study includes drivers that would impact crucially in the flip chip technology market growth and segments for a better understanding of the current market scenario.
However, its cost is still a challenge. The cost stems from wafer fabrication vendors, substrate vendors, and assembly/packaging subcontractors and it only increases with added assembling cost. But its pivotal role in consumer electronic devices can steer it out of future complication and ensure smooth market flow.
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Some of the major players in flip chip technology market are Samsung Group (South Korea), Intel Corporation (U.S.), Global Foundries (U.S.), UMC (Taiwan), ASE, Inc. (Taiwan), Amkor Technology (U.S.), STATS ChipPAC (Singapore), Powertech Technology (Taiwan), and STMicroelectronics (Switzerland), Texas Instruments (U.S.) among others.
The worldwide Flip Chip Technology Market has been segmented into five distinct parts and they are listed as below:
- Packaging Technology: 3D, 2.5D and 2D packaging technology.
- Wafer Bumping Process: Tin-lead eutectic solder, copper(CU) pillar, gold stud plated solder and lead-free.
- Packaging Type: FC BGA, FC LGA, FC QFN, FC CSP, FC PGA and FC SIP.
- Applications: Automotive, telecommunications, consumer electronics, military & aerospace, industrial and medical devices.
- Products: LED, CMOS image sensor, mixed signal, CPU, analog, RF, SoC and power IC.
The global market for flip chip technology has been successful in establishing itself across the globe. Some of the major regions include North America, Europe, Asia Pacific and Rest of the World.
Region-wise the area that has the upper hand is Asia Pacific. It is anticipated to stay in the lead and develop throughout the forecast period at an encouraging CAGR. The countries like China and India have a vast scope for development as they are the prime manufacturing centers. It is believed that these regions will open doors to many new and exciting opportunities for the market.
After Asia Pacific, North America is second in command, it grabs largest market share after APAC. This fact can be attributed to the presence of major market players in this area and the high expenditure on R&D activities.
Tokyo Denkikagaku Kōgyō Corporation (TDK) recently showcased the upgraded model of AFM GGI flip chip model which features new horn designs to provide linear X-Y nozzle movement for die sizes up to 10mm2. This will increase its performance and bring-in a lead-free process.
Kulicke & Soffa Industries announced the launch of Katalyst that boasts of leading-edge technology to provide high accuracy flip chip bonder. Its advanced capabilities ensure better performance in automated ground vehicles (AGV).
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- Wafer manufacturers
- Raw material and manufacturing equipment suppliers
- Chip manufacturers
- System integrators
- Device manufacturers
- Foundry players
- Distributors and retailers
- Research organizations
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