3D IC Market 2017-2022: Global Industry Size, Sales Revenue, Historical Analysis, Business Growth, Key Vendors, Development Status, Regional Trends and Forecast 2022

3D IC Market 2017-2022: Global Industry Size, Sales Revenue, Historical Analysis, Business Growth, Key Vendors, Development Status, Regional Trends and Forecast 2022

“Market Research Future”
Market Research Future published a research report on “3D IC Market Research Report- Global Forecast to 2022” – Market Analysis, Scope, Stake, Progress, Trends and Forecast to 2022.

Market Overview

The global 3D IC market has been increasing rapidly over the past few years; mainly due to the burgeoning industries such as semiconductor and consumer electronics. After witnessing a thriving success in the past, the 3D IC market is proceeding further towards to mark the indelible heights, fulfilling the augmented demands for smarter and compact devices. The market is booming and expected to gain prominence over the forecast period.

According to Market Research Future (MRFR), the global 3D IC Market is expected to grow with a double-digit CAGR of 17% throughout the review period (2016-2022).  Semiconductor & microelectronics industries are proliferating, witnessing a rising trend for vertically stacked integrated circuits (ICs). This can be a viable solution for requirements of electronic devices, providing high performance and increased functionality at much-reduced power consumption.

Additional factors influencing the growth of the market include the increasing demand for advanced electronic products, new packaging technology, and semiconductors. Also, technological innovations and high demand for 3D packaging using TSVs are key driving forces behind the growth of the 3D IC market.

3D ICs are in high demand by military & aerospace and medical & consumer electronics industries to fulfill the need of integrating disparate technologies, including logic, RF, memory, and sensors in small forms for industrial applications. Also, another emerging trend in the semiconductor industry, 3D packaging using silicon vias (TSVs) technology, is driven by the need for improving performance and reducing timing delays.

The semiconductor industry needs low cost, high aspect ratio, reliable via formation, and filling technologies. Assembly and wafer fabrication companies are increasingly looking for 3D TSV technology as functional integration requirement increases.

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Key Players:

Some of the major players in Global 3D IC market include Xilinx Inc., Tezzaron Semiconductor Corporation, and BeSang Inc., Monolithic 3D Inc., United Microelectronics Corporation, 3M Company, Intel Corporation, and, IBM Corporation.

Market Segmentation:

The report is segmented into five key market dynamics to widen the scope of understanding,

  • By Technology: Type (3D stacked ICs, monolithic 3D ICs, others) and Packaging & Integration {3D system-in-package (Sip), 3D wafer-level packaging (WLP), 2.5D & 3D interposing, and 3D heterogeneous integration}.
  • By Components : Through Silicon Vias (TSVs) and Through Glass Vias (TGVs), among others.
  • By Products: 3D Memory, CMOS Image Sensors (CIS), MEMS & Sensors, and Light Emitting Diodes.
  • By Application: IT/Telecommunication, Consumer Electronics, Industrial, Aerospace & Defense, Automotive, and Medical, among others.
  • By Regions: Asia Pacific, North America, Europe, and the Rest-of-the-World.

Regional Analysis:

The Asia Pacific region dominates the global 3D IC market with the largest market share. High development in the field of manufacturing industry and the significant presence of semiconductor manufacturing companies give the APAC an edge over other regions. Moreover, the emerging demand from the growing consumer electronics market in the region is expected to support the region to grow with the highest revenue by 2022.

The region is also expected to be the fastest-growing market during the forecast period. The rapidly developing economy in the region is inviting major manufacturers to establish their business unit in Asian countries, such as India and China. High consumption of 3D ICs in the different applications is pressurizing the OEMs.

North America stands the second-largest position in the global 3D IC market. The region is a hub for the development and adoption of innovative semiconductors technologies. The presence of a well-established infrastructure supports market progress, allowing implementations of advanced technologies.

Furthermore, the presence of major electronics manufacturers, increasing demand for digital technologies, and growing technological advancements are some of the factors attributing to the market increase of the 3D IC market in the region. The US, backed by the growing telecommunication and IT industry, majorly contributes to the regional market growth. The increasing demand for ICs in the US and Canada is on the constant rise.

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Target Audience:

  • Consumer electronics vendors
  • Data center service providers
  • Communication industries
  • Research and consulting firms
  • Small and large enterprises
  • Government agencies

About Us:

At Market Research Future (MRFR), we enable our customers to unravel the complexity of various industries through our Cooked Research Report (CRR), Half-Cooked Research Reports (HCRR), Raw Research Reports (3R), Continuous-Feed Research (CFR), and Market Research & Consulting Services.

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