Flip Chip Technology Market 2019 – Global Size, Analytical Overview, Business Strategy, Opportunity Assessment, Growth Factors, Segmentation and Regional Forecast 2023

Flip Chip Technology Market 2019 - Global Size, Analytical Overview, Business Strategy, Opportunity Assessment, Growth Factors, Segmentation and Regional Forecast 2023

“Market Research Future”
Market Research Future published a research report on “Flip Chip Technology Market Report- Forecast till 2023” – Market Analysis, Scope, Stake, Progress, Trends and Forecast to 2023.

Market Overview:

Integrated circuit (IC) packaging has been revolutionized with advents made in flip chip technology. Introduced by IBM Corporation in 1960, this component has been transforming the face of consumer electronic devices ever since. The semiconductor device is designed to incorporate solder bumps over the connection pads of the IC or micro-electromechanical system (MEMS). Subsequently, it creates a reliable connection between the component and the board and this flip chip technology is finding its popularity amidst mainframe computers, personal computers, servers, notebooks, smartphones, tablets, and in other devices. Its features such as low power cost and high-density packaging are helping flip chip technology in gaining traction. The global flip chip technology market is expecting a substantial 8.29% CAGR to scale new heights during the forecast period (2017-2023). Market Research Future’s (MRFR) detailed study includes drivers that would impact crucially in the flip chip technology market growth and segments for a better understanding of the current market scenario.

Get Free Sample Copy of Report @ https://www.marketresearchfuture.com/sample_request/5381

However, its cost is still a challenge. The cost stems from wafer fabrication vendors, substrate vendors, and assembly/packaging subcontractors and it only increases with added assembling cost. But its pivotal role in consumer electronic devices can steer it out of future complication and ensure smooth market flow.

Market Segmentation

The global Flip Chip Technology Market has been segmented in MRFR’s report on the basis of packaging technology, wafer bumping process, packaging type, product, application, and region. Wafer bumping process has been segmented to include copper (CU) pillar, lead-free, tin-lead eutectic solder, and fold stud plated solder.

Packaging technology has been segmented into 2D, 2.5D, and 3D packaging technology.

Packaging type has been segmented into flip chip ball grid array (FC BGA), flip chip pin grid array (FC PGA), flip chip land grid array (FC LGA), flip chip quad flat no-lead (FC QFN), flip chip system-in-package (FC SIP), and flip-chip chip scale package (FC CSP).

Product has been segmented into LED, CMOS image sensors, CPU, Rf, Analog, Mixed Signal & power IC, SoC, and others.

Applications of flip chip technology include consumer electronics, automotive, telecommunications, industrial, medical devices, military & aerospace, and others.

Key Players

Some of the major players in Flip Chip Technology Marketare Samsung Group (South Korea), Intel Corporation (U.S.), Global Foundries (U.S.), UMC (Taiwan), ASE, Inc. (Taiwan), Amkor Technology (U.S.), STATS ChipPAC (Singapore), Powertech Technology (Taiwan), and STMicroelectronics (Switzerland), Texas Instruments (U.S.) among others.

Regional Analysis

The Asia Pacific regional market is expected to have a leadership role in the market over the assessment period. The APAC’s dominance in the market is attributable to the presence of countries like China, and India which are significant manufacturing hubs in the region and have ample room for the introduction of new opportunities in the market. Moreover, the region has several leading market players who are making great strides in developing and implementing flip chip technology. North America is another market which is notable in the global flip chip market. The region’s inclusion of several leading market players as well as the high investments in r&D activities related to flip chips will likely drive the market. The region also has a high affinity for advanced technologies which drives the local market.

Industry Trend:

Tokyo Denkikagaku Kōgyō Corporation (TDK) recently showcased the upgraded model of AFM GGI flip chip model which features new horn designs to provide linear X-Y nozzle movement for die sizes up to 10mm2. This will increase its performance and bring-in a lead-free process.

Kulicke & Soffa Industries announced the launch of Katalyst that boasts of leading-edge technology to provide high accuracy flip chip bonder. Its advanced capabilities ensure better performance in automated ground vehicles (AGV).

Get Complete Report @ https://www.marketresearchfuture.com/reports/flip-chip-technology-market-5381

Intended Audience

  • Wafer manufacturers
  • Raw material and manufacturing equipment suppliers
  • Chip manufacturers
  • System integrators
  • Device manufacturers
  • Foundry players
  • Distributors and retailers
  • Research organizations

About Us:

At Market Research Future (MRFR), we enable our customers to unravel the complexity of various industries through our Cooked Research Report (CRR), Half-Cooked Research Reports (HCRR), Raw Research Reports (3R), Continuous-Feed Research (CFR), and Market Research & Consulting Services.

Media Contact
Company Name: Market Research Future
Contact Person: Abhishek Sawant
Email: Send Email
Phone: +1 646 845 9312
Address:Market Research Future Office No. 528, Amanora Chambers Magarpatta Road, Hadapsar
City: Pune
State: Maharashtra
Country: India
Website: https://www.marketresearchfuture.com/reports/flip-chip-technology-market-5381