Chip-On-Flex (COF) Market 2019 Global Analysis, Sales Revenue, Growth Opportunities, Regional Trends, Key Players, Developments Status, Segmentation and Potential of Industry Till 2021

Chip-On-Flex (COF) Market 2019 Global Analysis, Sales Revenue, Growth Opportunities, Regional Trends, Key Players, Developments Status, Segmentation and Potential of Industry Till 2021

“Market Research Future”
Market Research Future published a research report on “Global Chip On Flex Market Research Report- Forecast to 2021” – Market Analysis, Scope, Stake, Progress, Trends and Forecast to 2021.

Chip On Flex Market – Overview

The rising interest in flexible electronics is expected to create a favorable impetus for market growth in the coming period. Reports that dissect the semiconductors and electronics industry have been offered by Market Research Future, which produces reports on industry verticals that review the market progress and potentials. The market is expected to observe an estimated CAGR of 4.43 % while expanding earnings to USD 1795 Million by 2021.

The surging use of chip on flex is expected to be positively enhanced by its application in sensors, lighting products, and displays primarily. Moreover, the intensive pace of development in the technology domain is expected to create an optimistic growth period for the chip on flex market globally.

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Industry Updates:

Jul 2019 Apple is understood to utilize Chip-on-Glass and Chip-on-Flex display panels in its model in the coming years. Apple will transfer from COG displays to Chip-On-Plastic panels and Chip-On-Flex for the 2020 iPhone lineup, as the firm phases out LCD displays from its smartphones. COF will then be entirely substituted by Chip-on-Plastic in 2021 when the iPhone will completely move to virtual fingerprint recognition.

Chip on Flex Global Market   – Segmentation

The segmental overview of the Chip On Flex Market has been conducted on the basis of applications, types, regions, and verticals. Based on the types, the chip on flex market is segmented into one-sided chip on flex and others. The applications-based segmentation of the chip on flex market consist of dynamic and static flexing. On the basis of the verticals, the chip on flex market is segmented into electronics, military, aerospace, medical, and others. Based on the regions, the chip on flex market is segmented into Asia Pacific, North America, Europe, and other global regions.

Key Players

The prominent players in the market of Chip On Flex Market are – LGIT corporation (U.S.), Stemko group(Korea), Flexceed(Japan) , Chipbond technology corporation(Taiwan), CWE(Taiwan), Danbond technology co. ltd.(China), AKM industrial company ltd.(China), compass technology company limited(Hong Kong), Compunetics(U.S.), and Stars microelectronics public company ltd (Thailand) among others.

Chip on Flex Global Market   – Regional Analysis

The regional investigation of the chip on flex market covers regions in the world such as Asia Pacific, North America, Europe, and other global regions.  The Asia Pacific region is projected to log the uppermost development rate owing to the presence of a huge number of the chip on flex manufacturers in China who are playing a crucial role in the market’s expansion. Also, the Asia Pacific region is projected to be followed by the North American region due to the augmented implementation of novel technologies particularly in the automobile sector.  The North American pool of shares is also aiding in mergers of numerous organizations to improve the manufacturing capabilities in chip on flex market.  Many well-established companies are growing their sales area in the European region, which will spearhead to the development of the European region in chip on flex market.

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Intended Audience

  • COF manufactures
  • Industries such as aerospace, automotive, IT, industrial, and medical, among others
  • Government institutions
  • Research institutions
  • Adhesive manufacturers
  • Conductor and insulator manufacturers like silver, copper and others

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