Lucintel’s latest market report analyzed that high density packaging provides attractive opportunities in the consumer electronics, aerospace & defense, healthcare, IT & telecom, automotive, energy & utility industries. The high density packaging market is expected to grow at a CAGR of 11% to 13%. In this market, consumer electronics is the largest segment by end use industry.
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Based on end use industry, the high density packaging market is segmented into consumer electronics, aerospace & defense, healthcare, IT & telecom, automotive, energy & utility, and others. The consumer electronics segment accounted for the largest share of the market in 2020 and is expected to register the highest CAGR during the forecast period, due to high density semiconductor packaing have given rise to smaller, lighter, and more portable devices, such as tablets, smartphones, and the emerging IoT devices.
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The High density packaging Market is marked by the presence of several big and small players. Some of the prominent players offering high density packaging include Oshiba, IBM, Fujitsu, Hitachi, and Mentor
This unique research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link email@example.com.
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