Lucintel’s latest market report analyzed that low dielectric resin provides attractive opportunities in the PCB, wire & cable, antenna, microelectronics, and radome applications. The low dielectric resin market is expected to reach $1.4 billion by 2027 with a CAGR of 6.7%. In this market, fluoropolymer is the largest segment by resin type, whereas PCB is largest by application. Increasing uses of low dielectric resin in microfluidic chips for medical device and low dielectric resin in high speed PCBs for low signal loss and high frequency provides strategic growth path in this market.
Download Brochure of this report by clicking on https://www.lucintel.com/low-dielectric-resin-market.aspx Based on resin type, the low dielectric resin market is segmented into fluoropolymer, cyanate ester, cyclic olefin copolymer, m-PPE, polyimide, PET, and others. The fluoropolymer segment accounted for the largest share of the market in 2021 and is expected to register the highest CAGR during the forecast period, due to increasing awareness of customers on skincare.
Browse in-depth TOC on “Low Dielectric Resin Market”
68 – Tables
107 – Figures
242 – Pages
The Low Dielectric Resin Market is marked by the presence of several big and small players. Some of the prominent players offering low dielectric resin include Huntsman Corporation, Lonza Group, ZEON Corporation, SABIC Corporation, and Chemours Company.
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