Integrated Passive Device or IPD’s is a growing technology which offers ideal trade-off for system in package integration. Passive devices are essential parts of System–in-Package (SiP) solutions and today, it is getting used in various functions in semiconductor industry including- s decoupling, biasing, resonating, filtering, matching and transforming among others. As, the new technologies are coming into picture and demand for the small, lightweight products are increasing, it is also driving the market of integrated passive devices. Integration of passive devices on the silicon wafers, companies are achieving new levels and becoming capable of producing IPDs which are significantly smaller, thinner and higher performance than the standard discrete passive devices. According to a recent study report published by the Market Research Future, The global market of Integrated Passive Devices Market is booming and expected to gain prominence over the forecast period. The market is projected to demonstrate a spectacular growth by 2022, surpassing its previous growth records in terms of value with a striking CAGR during the anticipated period (2016 – 2022).
The aspects such as growing adoption of integrated passive devices in consumer electronics and the implementation of integrated passive devices in RF applications are the major driving factors for this market. However, factors such as high cost of integrated passive devices compared to discrete components is hampering the market growth. Further, the RF tuning of integrated passive devices demands longer product design cycle, which acts as a major restraining factor for the market.
On Semiconductor (U.S.), Infineon Technologies AG (Germany), Texas Instruments Inc. (U.S.), STMicroelectronics (U.S.), Micron Technology, Inc. (U.S.), STATS ChipPAC Ltd (Singapore), Global Communication Semiconductors, Inc. (U.S.), Global Communication Semiconductors, LLC (U.S.), 3DiS Technologies (France), OnChip Devices, Inc. (U.S.), Johanson Technology, Inc. (U.S.) are some of the prominent players at the forefront of competition in the Global Integrated Passive Devices Market and are profiled in MRFR Analysis.
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May 11, 2016 – STATS ChipPAC Pte. Ltd., a leading provider of advanced semiconductor packaging and test services, announced that it has shipped over one billion fan-out wafer level packages (FOWLP), also known in the industry as embedded Wafer Level Ball Grid Array (eWLB). FOWLP or eWLB is an advanced packaging technology platform that provides ultra-high density interconnection, superior electrical performance and the ability to integrate multiple heterogeneous dies in a cost effective, low-profile semiconductor package.
January 19, 2018– As the preferred solution for semiconductor reference designs, Johnson Technology has joined Sigfox’s preferred partner network as an antenna and RF-front end solutions provider. Theirs embedded ceramic antenna and design services for small-cell IoT environment makes it a great fit for this cooperative effort.
Integrated Passive Devices Market Global Market – Competitive Analysis
The market of Integrated Passive Devices market appears to be highly competitive. To maintain their market position and to drive the market growth, various dynamic and diversified international organizations, domestic organizations and as well as new entrants form a competitive landscape. Market leaders are innovating continuously and increasingly seeking market expansion through various strategic mergers and acquisitions, innovation, increasing investments in research and development and cost-effective product portfolio. Major players are investing on internal R&D and, most of all, in acquiring other firms.
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The global Integrated Passive Devices market is divided into four regions, namely North America, Asia Pacific Europe and the Middle East and Africa (MEA). North America stands as second biggest market for the IPDs. Development by the key companies and presence of countries such as U.S. and Canada in this region gives North American region a huge boost in the market. Asia Pacific stands as third biggest market. Presence of global high number of semiconductor companies are advancement in the consumer electronics segment is giving a huge boost to the market.
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