The advancements in Electronic Design Automation design systems in driving the cloud Electronic Design Automation design market. The major factor contributing the growth of cloud Electronic Design Automation market is licensing advantage. Apart from it the cloud Electronic Design Automation systems do not require a dedicated system and also solves the storage issues as all the data is stored on cloud.
Increasing production of electronic hardware devices is also contributing to the cloud electronic design automation market. As the cloud Electronic Design Automation systems provide a pay-per-usage model, it successfully reduces the costs. Thus reduction in costs is responsible for the growth in the cloud electronic design market.
The Global Cloud Electronic Design Automation Market is growing rapidly over 5.51% of CAGR and is expected to reach at USD 7595.8 million by the end of forecast period 2022.
Taste the market data and market information presented through more than 30 market data tables and figures spread over 100 numbers of pages of the project report. Avail the in-depth table of content TOC & market synopsis on “The Global Cloud Electronic Design Automation Market Research Report -Forecast to 2022”.
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The prominent players in the global Cloud Electronic Design Automation Market are Cadence Design Systems, Mentor Graphics, Synopsys, Agilent, Agnisys, Aldec, Ansys, JEDA Technologies, MunEDA, Sigrity, Zuken among others.
Global Cloud Electronic Design Automation Market Segmentation
The global Cloud Electronic Design Automation market has been segmented on the basis of type, application and region. On the basis of type, the market is classified into the market is fragmented into CAE, SIP (semiconductor intellectual property), IC Physical Design and Verification, Printed Circuit Board (PCB) and Multi-chip Module (MCM). By application, the market is categorized into Military/Defense, Aerospace, Telecom, Automotive, Industrial and others. Largest market share is acquired by the military/defense application segment.
Cloud Electronic Design Automation (EDA) Market is growing with the positive growth in all the regions. Growing need of efficient and automated manufacturing system in the industry is driving the market of cloud EDA around the world. By geography, North America is dominating the market due to the presence of global players in the region and high development in the field of technology and cloud computing is supporting the market growth in North America region. Also, high development and adoption of automation in the manufacturing sector in U.S. and Canada is also helping the market growth. Asia-Pacific stands as second largest market for cloud EDA. Rich presence of semiconductor manufacturing companies in China, Japan and South Korea are some of the major driving factors supporting the market in Asia Pacific. Also, high demand for consumer electronic products from the region is forcing the manufacturers to adopt latest technologies in the manufacturing process. Europe stands as third largest market for the cloud EDA. Presence of developed countries such as Germany, France, Italy, Netherlands and U.K. are one of the major driving factor behind the growth of the market in Europe region. Also, growing automotive industry in European region is also driving the market
December, 2017, M31 Technology Corporation, a global Silicon Intellectual Property (IP) boutique, today announced that M31 28nm PHY with Corigine’s USB 3.1 Gen 2 PC host and device controller intellectual property (IP) is certified by the USB Implementers Forum (USB-IF) and compliant with USB SuperSpeed+, the fastest USB speed standard. M31 is pleased to offer the 3.1 Gen 2 PHY in various process nodes including 28nm, 12nm and 7nm,” adds Scott Chang, M31’s vice president. M31 is delighted to have USB-IF certification along with Corigine’s USB Gen 2 controllers and pleased to offer the 3.1 Gen 2 PHY in 28nm as part of Corigine’s complete and highly competitive offering.
December, 2017, -Toshiba Electronic Devices & Storage Corporation has today started to ship five new high-current photorelays in DIP4 and DIP6 packages, additions to its portfolio of photorelays incorporating MOSFETs fabricated with the latest U-MOS VIII process. The new photorelays offer multiple options, with an off-state output terminal voltage ranging from 30 to 200V and a steady on-state current of 0.7 to 5.0A. They can replace 1-Form-A mechanical relays in various DC and AC applications, contributing to improved system reliability and reducing the space needed for relays and relay drivers. They deliver a rated operating temperature of 110°C (max), making it easier to accommodate temperature margins in system designs.
- Investors and consultants
- System Integrators
- Government Organizations
- Research/Consultancy firms
- Technology solution providers
- Hardware manufacturers
- Semiconductor Companies
- IC manufacturers
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