Hybrid Memory Cube And High-Bandwidth Memory Market 2018 Global Size, Share, Analysis, Emerging Opportunities, Development Status, Competitive Landscape and Trends by Forecast 2023

“Hybrid Memory Cube And High-Bandwidth Memory Market”
Hybrid Memory Cube and High-Bandwidth Memory Market Research Report – by memory type ( HMC, HBM), by product ( CPU, FPGA, GPU, ASIC), by application areas (HPC, networking and telecommunication, consumer electronics) region – Forecast till 2023

Market Insights:

Market Research Future’s latest report on the global hybrid memory cube (HMC) and high-bandwidth memory (HBM) market estimates growth at a highly promising CAGR of 35% during the forecast period of 2017 to 2023. HMC & HBM are RAM interfaces of which HMC devices use a separate processor to increase memory capacity, while HBM uses a graphical processing unit in the same package to provide tightly-coupled high speed. The increasing demand for HMC & HBM is driven primarily by its applications which are expected to lead the market to an estimated market value of USD 3.7 Bn.

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Hybrid memory cube and high bandwidth memory devices have applications in data centers, smartphones, & high-end computation devices. The technology is backed by tech giants in the industry due to the potential it has. HBM was developed to counter the issue of increasing power usage and to deliver high performance, scalability and power efficiency. HBM has applications in graphics and computing. Meanwhile, HMC was developed for applications in high-end servers, and this technology offers a high bandwidth, power efficiency, scalability, versatility on different platforms and a reduced physical footprint. the various features associated with HMC and HBM act as key drivers of market growth. Additionally, Advancements in technology has yielded high performance end-user devices and led to an increased demand for high performance across the board in IT & technology. As a result, the demand for HBM & HMC has grown significantly to provide the market with exponential growth over the forecast period.

Market Segmentation:

The global Hybrid Memory Cube And High Bandwidth Memory Market are segmented into memory type, product type, application, and region. By memory type, the market is divided between hybrid memory cube (HMC) and high-bandwidth memory (HBM). By product type, the market includes field programmable gate array (FPGA), central processing unit (CPU), application-specific integrated circuit, graphics processing unit (GPU), and accelerated processing unit. Hybrid memory cube and high bandwidth memory devices have application in high performance computing (HPC), data centers, networking & telecommunications, consumer electronics, and others.

Key Players:

Arira, SK Hynix Inc., Open-Silicon, Micron Technology, Inc., Fujitsu Ltd., Rambus Inc., Arm Holdings, Intel Corporation, Cadence Design Systems, Inc., Cray Inc., IBM Corporation, Advanced Micro Devices, Inc., Xilinx, Inc., Samsung Group, Nvidia Corporation, Marvell Technology Group, Ltd., and Taiwan Semiconductor Manufacturing Company, Ltd. are among market players of note who have been included in MRFR’s competitive analysis.

Regional Analysis:

By geography, the market is studied in North America, Europe, Asia Pacific and rest of the world. Among these regions, the market is majorly dominated by North America at present due to a higher concentration of key players in countries like U.S. and Canada.The rising adoption of artificial intelligence is fuelling the market in this region.

On the other hand, Europe is expected to show a decent market growth concerning the hybrid memory cube and high-bandwidth memory market. The demand for cloud-based services across various industries like healthcare and automotive are pushing the demand for global hybrid memory cube and high-bandwidth memory market. However, the Asia Pacific region is expected to show a significant growth throughout the forecast period. Rising demand for network equipment and the rising number of manufacturing activities in consumer electronics sector are driving the market in this region. The rising trend for the system on a chip integration (SoC) is driving the market in this region.

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Latest Industry News:

AMD has launched its “dual-Vega Radeon Pro V340” which is a high-performance card that includes the second generation of ECC and HBM.

TABLE OF CONTENTS

1 Executive Summary

2 The Scope Of The Report

2.1 Market Definition

2.2 Scope Of The Study

2.2.1 Research Objectives

2.2.2 Assumptions & Limitations

2.3 Markets Structure

LIST OF TABLES

Table 1 Global Hybrid Memory Cube And High Bandwidth Memory Market: By Region, 2017-2023

Table 2 North America Hybrid Memory Cube And High Bandwidth Memory Market: By Country, 2017-2023

Table 3 Europe Hybrid Memory Cube And High Bandwidth Memory Market: By Country, 2017-2023

Table 4 Asia Pacific Hybrid Memory Cube And High Bandwidth Memory Market: By Country, 2017-2023

Table 5 The Middle East & Africa Hybrid Memory Cube And High Bandwidth Memory Market: By Country, 2017-2023

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LIST OF FIGURES

FIGURE 1 Global Hybrid Memory Cube And High Bandwidth Memory Market Segmentation

FIGURE 2 Forecast Methodology

FIGURE 3 Porter’s Five Forces Analysis Of Global Hybrid Memory Cube And High Bandwidth Memory Market

FIGURE 4 Value Chain Of Global Hybrid Memory Cube And High Bandwidth Memory Market

FIGURE 5 Share Of Global Hybrid Memory Cube And High Bandwidth Memory Market In 2017, By Country (In %)

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