Global Three-dimensional Integrated Circuit Market Research Report Covers Historical Market Trends, Current Market Dynamics, Market Valuation by Segmentation as Well as Region, Risk and Opportunity Assessment, Country-level Analysis for Every Segment, Key Player’s Market Share Analysis, Competitive Landscape and Supply Chain Analysis.
Market Research Future (MRFR)’s analysis has revealed that the global 3D IC market is expected to thrive at a robust CAGR of 17% during the forecast period 2016 to 2022.
Some of the major key players of the global 3D IC market profiled in this MRFR report are Xilinx Inc., BeSang Inc., Tezzaron Semiconductor Corporation, 3M Company, United Microelectronics Corporation, Intel Corporation, Monolithic 3D Inc., and IBM Corporation.
- Globally 3D ICs market is expected to grow with 17% CAGR during 2016-2022.
- By type, 3D stacked IC is dominating the market whereas monolithic 3D IC is expected to be the fastest growing segment with approximately 20% CAGR during forecast period 2016-2022.
- Through silicon vias (TSVs) are projected to grow with approximately 19% CAGR
- Geographically, Asia-Pacific is dominating the 3D ICs market and expected to grow with 17% CAGR whereas North America is projected to be the fastest growing market
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The assessment also suggests that the market is set to scale a considerable valuation by the end of the review period. The ongoing trend of miniaturization witnessed in the consumer electronics industry is poised to drive the expansion of the global market over the next couple of years.
The growing demand for energy efficiency is another major factor responsible for the proliferation of the 3D IC market in the forthcoming years. 3D integrated circuits are anticipated to penetrate major industry verticals such as healthcare, aerospace, etc. which is prognosticated to accelerate revenue creation for market participants.
3D ICs offer certain advantages such as efficient thermal management, low power consumption, quick data processing & transmission, etc. These are projected to drive the growth of the 3D IC market over the next few years. In addition, the continuous upgradation of technology is anticipated to unleash a myriad developmental opportunity into the market in the years to come.
- Consumer electronics vendors
- Data center service providers
- Communication industries
- Research and consulting firms
- Small and large enterprises
- Government agencies
In January 2019, a custom-chips-on-demand company, zGlue, Inc., has released ChipBuilder, a cloud-based chip design software, and announced the introduction of the first multi-project 3D-IC prototyping service. This service has been launched in partnership with TSMC and ASE.
In December 2018, Intel Corporation, an American semiconductor manufacturing company, has briefed about its upcoming technology called Foveros, which is a 3D packaging technology that would enable complex and different logic chips to be stacked on top of each other.
In October 2018, 3D Systems, a leader in 3D printers, has unveiled its ProJet MJP 2500 IC 3D printer. It enables the production of wax patterns at a lower cost and lesser time.
By technology the global 3D IC market has been segmented into packaging & integration (3D system- in-package (Sip), 2.5D & 3D interposing, 3D wafer level packaging (WLP), and 3D heterogeneous integration) and type (3D stacked ICs and monolithic 3D ICs).
By components, the 3D IC market has been segmented into through silicon vias (TSVs), through glass vias (TGVs), and others.
By products, the global 3D IC market has been segmented into CMOS image sensors (CIS), 3D memory, MEMS & sensors, and light emitting diodes.
By application, the 3D IC market has been segmented into IT/telecommunication, consumer electronics, industrial, aerospace & defense, automotive, medical and others.
By region, the global 3D IC market has been segmented into North America, Europe, Asia Pacific, and the Middle East & Africa. Asia Pacific has secured the forefront position in the global marketplace and is forecasted to retain its dominance over the next couple of years. The regional 3D IC market is expected to exhibit a relatively higher CAGR of 17% across the forecast period. The market is likely to benefit from the accelerated economic activities in the consumer electronics industry.
North America is also expected to grow substantially in the foreseeable future. The region has been forecasted to expand at the second-highest CAGR in the forthcoming years. An upsurge in demand for integrated circuits in conjunction with technological upgradations is likely to propel the expansion of the 3D IC market across the assessment period. The major country-level markets in the region that are anticipated to contribute significantly are the U.S. and Canada.
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Table of Contents
1 Executive Summary
2 Market Dynamics
2.1 Market Drivers
2.2 Market Challenges
2.3 3d Ics Supply Chain
2.4 Porter’s Five Forces Analysis
3 Global 3d Ics Market, by Technology
3.1 3d Ic Technology Type Market
3.1.1 Market by Sub-segment
3.2 3d Ic Packaging & Integration Type
4 Global 3d Ic Market, by Component
4.2 Market by Sub-segment
4.2.1 Through Silicon Vias (Tsvs)
4.2.2 Through Glass Vias (Tgvs)
List of Tables
Table 1 Global 3d Ic Market by Technology Type, 2016-2022 (Usd Million)
Table 2 Global 3d Stacked Ics Market, 2016-2022 (Usd Million)
Table 3 Global Monolithic 3d Ics Market, 2016-2022 (Usd Million)
Table 4 Global 3d Ic Market, by Component, 2016-2022 (Usd Million)
Table 5 Global Through Silicon Vias (Tsv) in 3d Ic Market, 2016-2022 (Usd Million)
Table 6 Global Through Glass Vias (Tgv) in 3d Ic Market, 2016-2022 (Usd Million)
Table 7 Global 3d Ic Market, by Product, 2016-2022 (Usd Million)
List of Figures
Figure 1 Global 3d Ics Market: Drivers & Challenges
Figure 2 Global 3d Ic Supply Chain
Figure 3 Global 3d Ic Market: Porter’s Five Forces Analysis
Figure 4 Global 3d Ic Market by Technology Type, 2016-2022 (Usd Million)
Figure 5 Global 3d Stacked Ics Market, 2016 & 2022 (Usd Million)
Figure 6 Global Monolithic 3d Ics Market, 2016 & 2022 (Usd Million)
Figure 7 Global 3d Ic Market, by Component, 2016-2022 (Usd Million)
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